- solder reflow technique
- метод паяння оплавленням припою
English-Ukrainian dictionary of microelectronics. 2013.
solder reflow technique
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Bead probe technology — (BPT) gives the electronics industry a new alternative in providing electrical access (called “node access”) to printed circuit board (PCB) circuitry needed to perform In Circuit Testing (ICT). Node access is critical for components on the PCB to … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
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Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f … Wikipedia
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
nvSRAM — is a type of non volatile computer memory. It is similar in operation to SRAMs. The current market for non volatile memory is dominated by BBSRAMs, or Battery Backed Static Random Access Memory. However, BBSRAMs are slow and suffer from ROHS… … Wikipedia
